974 Centre Road
Wilmington, DE 19805
455 Forest Street
Marlborough, MA 01752
INSULECTRO is the distributor for this and other DuPont Electronic Solutions products.
COPPER GLEAM™ XP-6339
An acid copper for pattern plate viafilling
COPPER GLEAM™ XP-6339 plating products are used in DC pattern plate processes for microvia filling. This can be applied to HDI construction in PWB fabrication and for IC Substrate fabrication.
- Good in fine line pattern plating and microvia filling
- Rectangular track profile, good for wire-bonding
- Suitable for insoluble anode and impingement system
- Two component system, easy to control
- Fully analyzable additive system
- Stable, bright, and ductile deposits with high leveling properties
- High-purity deposits with excellent overplating and decorative characteristics
- Increased reliability for meeting advanced miniaturization demands
- Lower consumption and energy costs
- Easy to control, economical to operate
Electrolytic Copper plating creates the conductive pathways within printed circuit boards. DuPont Electronic Solutions provides extensive options to suit user requirements, whether DC or Pulse rectification; horizontal or vertical equipment; panel or pattern plate. Processes are available to meet the needs of the thinnest or thickest boards, mixed technology HDI boards or dense chip packaging substrates.
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