2030 Dow Center
Midland, MI 48674
455 Forest Street
Marlborough, MA 01752
East Coast Electronic Material Supply LLC is the distributor for this and other Dow Electronic Materials products.
AUROLECTROLESS™ SMT Immersion Gold
Immersion gold process designed to produce pure gold deposits on metallic substrates
AUROLECTROLESS™ SMT is an immersion process designed to produce solderable, uniform fine-grained deposits of soft, pure gold on metallic substrates such as copper, nickel and palladium.
- Excellent solderability
- Exhibits excellent pH stability
- High tolerance to metallic contamination
- Deposits are aluminum wire bondable when applied over nickel
- Highly stable solution
- Uniform deposits
- Excellent adhesion
- Superior nickel protection
The immersion gold process is typically the last operation in building a printed circuit board and therefore the quality of deposit and process yield are very important. Dow Electronic Materials has developed immersion gold process technology that provides an easy to use, high and consistent quality solderable finish for the most demanding printed circuit designs.
Copyright © All rights reserved.