974 Centre Road
Wilmington, DE 19805
(800) 345-9999

455 Forest Street
Marlborough, MA 01752
(508) 481-7950
INSULECTRO is the distributor for this and other DuPont Electronic Solutions products.


Vertical pulse plate for high aspect ratio

The COPPER GLEAM CUPULSE process was designed for copper plating of printed circuit boards using PPR current. This process is especially suited for reducing cycle times on thick-panel, high-aspect ratio designs.

Key Features
  • Versatile PPR plating system
  • High aspect ratio and mixed technology capability
  • Novel analytical methods ensure the process remains in control and at the optimum set points during operation - the analytical procedures are quick and simple to run

  • Unsurpassed performance on thick-panel, high aspect ratio applications
  • Stable, consistent plating performance over the lifetime of the bath
  • Superior through-hole leveling performance

Utilization of periodic pulse rectification allows for improved throwing power and surface distribution of plated copper versus conventional DC plating. DuPont Electronic Solutions has developed a range of additives to provide optimum results for horizontal and vertical applications.