2030 Dow Center
Midland, MI 48674
455 Forest Street
Marlborough, MA 01752
East Coast Electronic Material Supply LLC is the distributor for this and other Dow Electronic Materials products.
COPPER GLEAM™ CUPULSE
Vertical pulse plate for high aspect ratio
The COPPER GLEAM™ CUPULSE process was designed for copper plating of printed circuit boards using PPR current. This process is especially suited for reducing cycle times on thick-panel, high-aspect ratio designs.
- Versatile PPR plating system
- High aspect ratio and mixed technology capability
- Novel analytical methods ensure the process remains in control and at the optimum set points during operation - the analytical procedures are quick and simple to run
- Unsurpassed performance on thick-panel, high aspect ratio applications
- Stable, consistent plating performance over the lifetime of the bath
- Superior through-hole leveling performance
Utilization of periodic pulse rectification allows for improved throwing power and surface distribution of plated copper versus conventional DC plating. Dow Electronic Materials has developed a range of additives to provide optimum results for horizontal and vertical applications.
Copyright © All rights reserved.